Semiconductor Metrology System

Semiconductor Metrology Systems

The Semiconductor Metrology Systems for wafer thickness measurement lineup includes the Proforma 300i and Proforma 300iSA series. One of the most critical components in electrical equipment is the semiconductor wafer, which helps regulate the current throughout the system. When handling these components, wafer thickness measurement is a key consideration. Using MTI Instruments’ range of wafer measurement tools—such as wafer thickness measurement instruments, wafer thickness gauges, and wafer thickness measurement systems—makes adhering to industry standards significantly easier.

The Proforma 300i Manual Semiconductor Metrology System
is a lightweight, benchtop, capacitance-based differential measurement system capable of non-contact wafer thickness measurements on semiconductor wafers. The Proforma 300iSA is a benchtop, Semi-automated Metrology System that provides comprehensive wafer surface scanning to measure thickness, thickness variation, bow, warp, site measurements, and overall flatness.

Different industries have specific requirements for their semiconductor wafers, and we help ensure your devices achieve the ideal thickness. Whether you need testing equipment for semiconductor metrology systems, semi-automated metrology systems, or solar metrology systems, we deliver the wafer measurement tools your engineers need to get the job done.